Thermal paste Vinga TG5

Thermal paste is a heat-resistant white or gray high-viscosity mass used to improve thermal conductivity between heat-generating elements of electronic circuits and the heatsink.

Vinga thermal paste is applied in a thin layer between the chip and the heatsink. It is designed to fill all micro-cracks, as well as scratches and metal deformations, to ensure maximum heat transfer between the core and the cooler heatsink.